4 Layer 1.6mm ENIG PCB Assembly For Communication Equipment

4 Layer 1.6mm ENIG PCB Assembly For Communication Equipment

♦ What's Telecom PCB Assembly?

​​Telecom PCB Assembly​​ refers to the manufacturing and assembly of printed circuit boards (PCBs) specifically designed for telecommunications equipment, such as:

• ​​5G/4G base stations​​
• ​​Fiber-optic networking devices​​
• ​​Satellite communication systems​​
• ​​Routers, switches, and modems​​
• ​​RF (Radio Frequency) and microwave systems​​

These PCBs require ​​high-frequency performance, signal integrity, and reliability​​ to handle fast data transmission, low latency, and harsh operational environments.

♦ Features of Telecom PCBs:

1. ​​High-Frequency Materials​​

   • Use ​​low-loss laminates​​ (e.g., Rogers, Teflon, or Isola) to minimize signal degradation at GHz frequencies.
   • ​​Controlled impedance​​ traces to prevent signal reflection.

2. ​​Multilayer & HDI (High-Density Interconnect) Designs​​

   • ​​8+ layers​​ for complex routing.
   • ​​Microvias & blind/buried vias​​ for compact, high-speed designs.

3. ​​RF & Microwave Components​​

   • ​​Antennas, amplifiers, filters​​, and ​​MMICs (Monolithic Microwave ICs)​​.
   • ​​Shielding​​ to reduce electromagnetic interference (EMI).

4. ​​Thermal Management​​

   • ​​Metal-core PCBs (e.g., aluminum)​​, heat sinks, or thermal vias to dissipate heat from high-power components.

5. ​​Strict Compliance Standards​​

   • • ​​IPC-A-600, IPC-6012​​ (for reliability).
     • ​​RoHS, REACH​​ (for environmental safety).
     • ​​FCC, CE, ITU-T​​ (for telecom regulations).

♦ Applications of Telecom PCBs:

• ​​5G Infrastructure​​ (Massive MIMO, mmWave antennas)
• ​​Optical Transceivers​​ (100G/400G data rates)
• ​​Satellite Communication​​ (Low Earth Orbit (LEO) systems)
• ​​IoT & Smart Devices​​ (NB-IoT, LTE-M modules)

♦ One-Stop PCBA Solution

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4 layer ENIG PCB assembly

1.6mm telecom PCB board

communication equipment PCB assembly

4 Layer 1.6mm ENIG PCB Assembly For Communication Equipment Images